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25th Electronics Packaging Technology Conference (EPTC2023), Singapore, Dec 5-8, 2023

 

The 25th IEEE Electronics Packaging Technology Conference (EPTC2023) is an international event organized by the IEEE RS/EPS/EDS Singapore Chapters and co-sponsored by the IEEE Electronics Packaging Society (EPS). Since its inauguration in 1997, EPTC has been established as a highly reputable international electronics packaging conference and is the IEEE EPS flagship conference in the Asia and Pacific Region. It aims to cover the complete spectrum of electronic packaging technology. Topics include modules, components, materials, equipment technology, assembly, reliability, interconnect design, device and systems packaging, heterogeneous integration, wafer-level packaging, flexible electronics, LED, IoT, 5G, emerging technologies, 2.5D/3D integration technology, smart manufacturing, automation, and AI. EPTC2023 will feature keynotes, technical sessions, invited talks, panels, workshops, exhibitions, and networking activities.

The EPTC technical program committee, with more than 100 experts from diverse semiconductor packaging technology areas, is committed to creating an engaging technical program for the international packaging community. The technical program will be supplemented by an exhibition, which provides an opportunity for leading companies to exhibit their latest technologies and products. Last year there were 430 attendees. This year being our 25th Anniversary, we have a special 4-day program and expect more attendees. Deadline for abstracts is June 15 but a slight delay is ok.

More details are available at the website https://www.eptc-ieee.net/ and flyer attached.

 

KEYNOTES

 

Douglas C.H. Yu is a distinguished Fellow and Vice President at TSMC R&D

Radha Nagarajan is Senior Vice President and Chief Technology Officer of Marvell’s Optical and Copper Connectivity Group

C P Hung, Vice President, Corporate R&D, ASE Group

 

EPTC 2022 conference video (Right click and open link).

 

 

 

STUDENT TRAVEL GRANTS FOR EPTC

 

To encourage students in the electronics packaging field to become members of EPS and actively participate in the flagship conferences of the society, up to 6 Student Travel Grants will be offered for EPTC annually. Also, to widen the representation of female students and students from underrepresented countries, at least two grants will be allocated to female student authors and one to a student from a country historically underrepresented at EPTC. Please find details on the EPTC website https://www.eptc-ieee.net/.

AFFILIATE MEMBERSHIP SUBSIDY PROGRAM

 To encourage EPS membership and engagement with EPS, EPS has initiated an Affiliate Membership Subsidy Program whereby non-member conference registrations at EPTC and the other two EPS flagship conferences will be offered a complimentary EPS Affiliate Membership for the following year. Please find details on the EPTC website https://www.eptc-ieee.net/.

Andrew Tay

General Chair, EPTC2023.

andrew_tay@ieee.org